Élaboration et caracterisation de revêtements durs Ti-Al, Ti-Al-N et Al-Cr-N

Abstract

This study focuses on the development and characterization of PVD thin film deposition of hard materials based on transition Ti, Cr doped with aluminum elements and / or nitrogen.Films TiAl, TiAlN and AlCrN were prepared by RF sputtering. The influence of film thickness on residual stresses was investigated.Analysis of residual stresses by the device shows that Newton's rings are compressive in nature, and are not homogeneous in terms of thickness.A peak stress 6GPa obtained for a power of about 250 W was observed for thicknesses of between 250 and 350 nm for the TiAl layer.Stresses decrease with temperature annealed suffered by AlCrN coatings and TiAl.The thickness of the layer increases with AlCrN the voltage applied Monitoring annealed at different temperatures samples coated TiAl, TiAlN and AlCrN we can note that Ti-Al films are stable up to 600 ° C; films Ti-Al-N are stable up to 800 ° C films and Al-Cr-N are stable up to 900 ° C.